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Apple, Amkor, and TSMC ‘neath the Arizona Skies – Computerworld

CoWoS could also hold interesting opportunities for Apple, as it’s an advanced chip packaging tech that can efficiently link graphics processors, memory, and CPU together. There may be some implications as Apple is expected to move to 2nm chips (made by TSMC, designed by Apple’s silicon teams, and based on Arm reference designs) in 2025.  TSMC Chairman and CEO C.C.…